Inspur Electronic Information Industry Raises 1 Billion Yuan From Bond Issue

MT Newswires Live

2025/02/18

Inspur Electronic Information Industry (SHE:000977) raised 1 billion yuan via the issue of its first ultra-short-term financing bond in 2025.

Proceeds will be used for corporate financing needs, according to a Tuesday filing with the Shenzhen bourse. The bond has a 2% interest rate.

Industrial and Commercial Bank of China (HKG:1398, SHA:601398) served as lead underwriter and Shanghai Pudong Development Bank (SHA:600000) served as the co-lead underwriter.

The information technology infrastructure products company's shares were down nearly 5% in recent trade.

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