Inspur Electronic Information Industry (SHE:000977) raised 1 billion yuan via the issue of its first ultra-short-term financing bond in 2025.
Proceeds will be used for corporate financing needs, according to a Tuesday filing with the Shenzhen bourse. The bond has a 2% interest rate.
Industrial and Commercial Bank of China (HKG:1398, SHA:601398) served as lead underwriter and Shanghai Pudong Development Bank (SHA:600000) served as the co-lead underwriter.
The information technology infrastructure products company's shares were down nearly 5% in recent trade.
免责声明：投资有风险，本文并非投资建议，以上内容不应被视为任何金融产品的购买或出售要约、建议或邀请，作者或其他用户的任何相关讨论、评论或帖子也不应被视为此类内容。本文仅供一般参考，不考虑您的个人投资目标、财务状况或需求。TTM对信息的准确性和完整性不承担任何责任或保证，投资者应自行研究并在投资前寻求专业建议。