Release Date: November 07, 2024
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
Q: Can you provide details on your wet clean product portfolio's coverage of the 3D NAND market? A: Our typical process cleaning covers almost 90% of the market. We are engaged in R&D and production for most tools, including specific actions for 3D NAND. By the end of this year, we expect to be qualified for all processes, indicating significant progress.
Q: What is your outlook for China's WFE spending next year, considering potential changes in US trade policy? A: We expect China's market to remain strong due to ongoing demand in memory and logic foundries. While it's hard to predict exact numbers, we anticipate steady growth. Regarding US trade policy, we will comply with all regulations and continue supporting global production ramp-ups.
Q: Given your consistent gross margins above target, what is your outlook for 2025? A: Our year-to-date gross margins are above 50%, driven by product mix and foreign exchange benefits. While we maintain a long-term target of 40-45%, our backlog margins are healthy. We expect to stick to this target range in the future.
Q: How do you foresee sales outside of China evolving next year? A: Expanding internationally is a corporate focus. We anticipate good growth in China and potential contributions from international markets, depending on customer evaluations and project statuses. Our new clean room in Oregon signifies our commitment to global expansion.
Q: What are the competitive advantages of your high-temperature SPM solutions? A: Our high-temperature SPM tool offers better cleaning environments and uptime due to controlled chemical splash. Our Tahoe tool, targeting lower and middle temperatures, provides excellent particle removal efficiency, making it suitable for advanced logic and memory applications.
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
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