Release Date: November 12, 2024
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
Q: Can you provide more insight into the HPC market and the potential overcapacity concerns, particularly regarding chiplets and HBM? A: Ramy Langer, COO, explained that HPC includes both chiplets and HBM, which grow together. While order percentages may vary quarterly, the expectation is for similar growth patterns in 2025 as seen this year. The bottleneck is currently due to 2.5D substrate capacity, expected to be resolved in 2025.
Q: What is the current and future revenue contribution from China, given its past significance? A: Ramy Langer noted that China's contribution is expected to be around 30-35% this year, down from over 40% previously. However, the business environment in China remains solid, and similar or slightly increased contributions are anticipated for 2025.
Q: Could you elaborate on the constraints in advanced packaging substrates and their impact on revenue outlook? A: Ramy Langer stated that the constraints are primarily in 2.5D substrates, but the company has a strong backlog and pipeline, ensuring confidence in Q4 2024 and Q1 2025 revenue growth. The positive trend in HPC is expected to continue into 2025.
Q: Can you provide details on the new product introduced and its market potential? A: The new product, set to launch officially in early 2025, targets high-end applications with superior inspection capabilities. It is expected to contribute tens of millions in revenue in 2025, with a gradual ramp-up throughout the year.
Q: How do you see the demand for silicon carbide and other specialty materials evolving? A: Ramy Langer indicated that interest in silicon carbide is picking up after a slow period, with growth expected in CMOS image sensors and fan-out applications. These areas are anticipated to contribute more significantly to the business in the coming year.
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
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