Hubei Dinglong (SHE:300054) received its first purchase order for temporary bonding adhesive products from a mainstream domestic wafer fab customer, according to a Shenzhen Stock Exchange disclosure on Wednesday.

The order is estimated to reach "several million yuan," the disclosure said.

The adhesive can be used for wafer-level packaging that requires the manufacture of a rewiring layer on a thinned wafer or 2.5D/3D packaging that requires TSV-related processes such as CMP on a thinned wafer, the Chinese manufacturer of imaging materials for toner and ink products said.