Taiwan Semiconductor Manufacturing's (TSM) Japan Advanced Semiconductor Manufacturing unit has started mass production at its first wafer fab in Kumamoto, Japan, multiple media outlets reported Friday, citing Kumamoto Governor Takashi Kimura.
The unit informed the local government about the start of operations at the semiconductor wafer facility on Dec. 23, Kimura reportedly said. The facility will mainly supply image sensors to Sony Semiconductor (SONY) and vehicle chips for Denso, reports said.
The first wafer fab project reportedly costs about 1.3 trillion Japanese yen ($8.27 billion), with up to 476 billion Japanese yen provided by Japan's Ministry of Economy, Trade and Industry, according to reports.
Construction on a second wafer fab will begin in Q1, with plans to start operations by 2027, reports said.
Taiwan Semiconductor Manufacturing, Sony and Denso did not immediately respond to MT Newswires' requests for comment.
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