HANMI Semiconductor (KRX:042700) began the construction of its seventh factory to produce thermocompression (TC) bonding bonders, essential for high-bandwidth memory manufacturing, the company said Tuesday.
The two-story, 4,356 pyeong facility, near the company's existing six production sites in Seo-gu, Incheon, is slated for completion by the fourth quarter of 2025. The expanded capacity is expected to boost sales potential to around 2 trillion won, the release said.
Shares of Hanmi Semiconductor rose nearly 4% in recent trade on Wednesday.
免責聲明：投資有風險，本文並非投資建議，以上內容不應被視為任何金融產品的購買或出售要約、建議或邀請，作者或其他用戶的任何相關討論、評論或帖子也不應被視為此類內容。本文僅供一般參考，不考慮您的個人投資目標、財務狀況或需求。TTM對信息的準確性和完整性不承擔任何責任或保證，投資者應自行研究並在投資前尋求專業建議。