Alpha HPA (ASX:A4N) secured a letter of intent from a thermal interface materials firm for the potential use of high-purity alumina from the HPA First project for use in semiconductors, according to a Tuesday filing with the Australian bourse.
Alumina is currently being used for the thermal encapsulation of semiconductor chips and as chemical mechanical planarization slurry to polish wafers, the filing said.
Company shares rose past 3% in recent Tuesday trade.
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