Taiwan Semiconductor's (TSM) new US plant is unlikely to receive the most advanced chip technology before factories in Taiwan because of compliance hurdles, including local construction rules and the permitting process, Reuters reported Friday, citing CEO C.C. Wei.

The new plant in Arizona has taken twice as long as in Taiwan, Wei said at National Taiwan University event late Thursday, adding that it will be difficult for the company to use its latest technology in the US before Taiwan, according to the report.

The company did not immediately respond to MT Newswires' request for comment.

(Market Chatter news is derived from conversations with market professionals globally. This information is believed to be from reliable sources but may include rumor and speculation. Accuracy is not guaranteed.)

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