Jilin Sino-Microelectronics (SHA:600360) plans to mortgage some of its assets for a loan worth 180 million yuan from China Construction Bank (HKG:0939, SHA:601939) for its business development needs, according to a Shanghai Stock Exchange disclosure on Jan. 22.
The assets comprise part of the company's real estate in High-tech Zone, Jilin City, China, which has a total land area of 112,387.81 square meters and a building area of 36,512.39 square meters, and part of its production machinery and equipment.
The mortgage period is 13 months, the filing said.
免責聲明:投資有風險,本文並非投資建議,以上內容不應被視為任何金融產品的購買或出售要約、建議或邀請,作者或其他用戶的任何相關討論、評論或帖子也不應被視為此類內容。本文僅供一般參考,不考慮您的個人投資目標、財務狀況或需求。TTM對信息的準確性和完整性不承擔任何責任或保證,投資者應自行研究並在投資前尋求專業建議。