Samsung Electronics (SSNLF) has received approval to supply 8-layer HBM3E high-bandwidth memory (HBM) chips to Nvidia (NASDAQ:NVDA), according to a Bloomberg report.
These chips, less advanced than the 12-layer version, were approved in December 2024 and will be used in Nvidia's AI processors for the Chinese market. Nvidia and Samsung have not commented on the matter. Samsung recently indicated that HBM sales may face temporary constraints in Q1 2025.
The HBM market is currently led by SK hynix and Samsung, with Micron Technology (NASDAQ:MU) playing a smaller role. SK hynix was the first to mass-produce 8-layer HBM3E in early 2024 and started supplying the 12-layer version by the end of 2024.
Samsung CFO Sooncheol Park stated that since Q3 2024, the company has been producing both 8-stack and 12-stack HBM3E chips, expanding supply to multiple GPU providers and data centers.
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