Feb 18 (Reuters) - Winbond Electronics 2344.TW:
SAYS EQUIPMENT PURCHASES FROM APPLIED MATERIALS, 3 OTHERS WILL BE INCREASED ABOVE ORIGINALLY PLANNED T$16 BILLION ($487.8 MLN)
WINBOND SAYS OTHER THREE EQUIPMENT SUPPLIERS ARE APPLIED MATERIAL SOUTH EAST ASIA, LAM RESEARCH INTERNATIONAL, TOKYO ELECTRON, KOKUSAI ELECTRIC
WINBOND SAYS INCREASED EQUIPMENT EXPENDITURE NECESSARY TO MEET MARKET DEMAND FOR ADVANCED AVAILABLE TECHNOLOGY
Source text: ID:nMOP5ZrbgH
Further company coverage: 2344.TW
(Reporting by Faith Hung)
((faith.hung@thomsonreuters.com;))
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