蘋果iPhone 16e拆解：自研5G基帶芯片細節曝光

芯智訊

2025/03/07

3月6日消息，近日市場研究機構TechInsights和專業拆解機構iFixit均發布了對於蘋果新機iPhone 16e的拆解報告，揭示了蘋果在功能設計、成本控制以及自研的C1基帶芯片等方面的細節。顯示屏在螢幕方面，TechInsights在今年2月份就證實，iPhone 16e的6.1英寸顯示屏將主要由京東方供應，以降低三星Display和LG Display的份額。預計，京東方將供應超過...

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16e的6.1英寸顯示屏將主要由京東方供應，以降低三星Display和LG Display的份額。預計，京東方將供應超過...</p>\n\n<a href=\"http://gu.qq.com/resources/shy/news/detail-v2/index.html#/?id=nesSN20250307104054abec356b&s=b\">網頁鏈接</a>\n\n</div>\n","source":"tencent","html":"<!DOCTYPE html>\n<html>\n<head>\n<meta http-equiv=\"Content-Type\" content=\"text/html; charset=utf-8\" />\n<meta name=\"viewport\" content=\"width=device-width,initial-scale=1.0,minimum-scale=1.0,maximum-scale=1.0,user-scalable=no\"/>\n<meta name=\"format-detection\" content=\"telephone=no,email=no,address=no\" />\n<title>蘋果iPhone 16e拆解：自研5G基帶芯片細節曝光</title>\n<style 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exposed","themeId":null,"isJumpTheme":false,"ttsUrl":null,"symbols_score_info":{"AAPL":1,"MACW.SI":0.6},"content_text":"3月6日消息，近日市場研究機構TechInsights和專業拆解機構iFixit均發布了對於蘋果新機iPhone 16e的拆解報告，揭示了蘋果在功能設計、成本控制以及自研的C1基帶芯片等方面的細節。顯示屏在螢幕方面，TechInsights在今年2月份就證實，iPhone 16e的6.1英寸顯示屏將主要由京東方供應，以降低三星Display和LG Display的份額。預計，京東方將供應超過1500塊螢幕，價格可能會比後兩者要略低，但平均售價(ASP)預計將超過25美元。處理器在處理器方面，iPhone 16e雖然搭載的是蘋果A18處理器，但是它的一個GPU內核被禁用，使得它只有4核GPU，而不是常規A18處理器的5核GPU——這是一個相當較小、但更經濟高效的修改。△iPhone 16e的主板依然是採用雙層堆疊△iPhone 16e主板上的蘋果A18處理器值得一提的是，TechInsights還指出iPhone 16e採用了SiTime時鐘芯片。SiTime CEO Rajesh Vashist周二在摩根士丹利主辦會議上也證實了此事，稱他們公司「在裏面有幾個芯片」。這也直接帶動了這家芯片公司周三股價飆漲20%。SiTime上個月公布的年報顯示，蘋果佔其去年總營收（2億美元）的約22%。根據TechInsights的估算，每部iPhone 16e手機中SiTime芯片的成本約為50美分。相機系統在相機系統方面，蘋果也對後置攝像頭採取了注重成本控制的方法，與iPhone 16上的雙攝像頭系統不同，iPhone 16e僅配備了一個後置的4800萬像素的Fusion攝像頭，可拍攝細膩動人的照片與視頻，同時支持 1200 萬像素 2 倍長焦功能，相當於同時擁有兩顆相機，讓使用者能以光學畫質進行變焦。預計攝像頭組件的成本相比iPhone 16將降低了30美元。△iPhone 16e與iPhone 16後蓋對比然而，前置攝像頭與iPhone 16一樣保持不變，保留了1200萬像素的原深感測相機系統，可以用於高質量的自拍和FaceTime通話，以及安全地進行解鎖iPhone、驗證購物付款、登入APP等操作。蘋果C1基帶芯片作為蘋果自研第一個5G基帶芯片——Apple C1，其基於台積電4nm製程（高通Snapdragon X75也是4nm製程）。而配套自研的FR1射頻芯片則 是基於台積電7nm製程（高通SDR875為14nm）。TechInsights稱，直流電源效率提高了25%。△iPhone 16e主板，紅色方框內為蘋果C1芯片iFixit稱他們與Yole Group半導體分層分析實驗室的朋友合作，將蘋果C1芯片拆開，並並放入了LumafieldNeptune CT 掃描儀中進行成像。△蘋果C1基帶芯片（上圖左側）實際位於射頻模組下方△蘋果的射頻芯片（左）與C1基帶芯片（右）掃描結果結果卻發現，C1基帶芯片實際位於射頻模組封裝的下方，其取代了高通 X71M基帶芯片，但是其封裝結構與高通X71M基帶芯片類似，包含基帶芯片與DRAM。相關報道顯示，C1基帶芯片雖然支持大多數關鍵的 4G 和 5G 技術，包括具有 4x4 MIMO 的 sub-6 GHz 5G網絡，具有 4x4 MIMO、FDD-LTE、TD-LTE 的千兆 LTE，以及兼容 2G 和 3G 網絡。但是並不支持5G毫米波，同時峯值下行速率可能只有4Gbps，遠遠落後於高通的5G基帶芯片。需要指出的是，採用自研的C1基帶芯片也有助於蘋果進一步降低成本，同時降低對於高通的依賴。隨着C1及後續迭代產品的推出，蘋果公司或將在2027年徹底放棄高通公司的基帶芯片，這使得蘋果還有兩年多的時間來完善其5G基帶芯片，以便未來全面轉向採用自研芯片。儘管高通在蘋果的射頻設計中仍扮演着次要角色，但iPhone 16e的上市標誌着該行業的重大轉變。電池iFixit拆解還顯示，iPhone 16e的電池比iPhone 16更大，為15.55Wh。這可能是由於iPhone 16e採用的是後置單攝像頭，使得內部能夠為電池留下更多的空間。更大的電池容量也使得iPhone 16e續航時間更長，蘋果稱其支持長達26小時的視頻播放。更易修復iFixit也指出，iPhone 16e 在維修性方面仍有一定進步，例如iOS取消部分零件綁定，讓第三方維修變得較為容易。此外，機身內部還新增了一個金屬支架，能夠保護排線，避免在拆機過程中意外損壞。這些改變顯示蘋果在提高設備可維修性方面做出了一些調整，使得其更易修復。iFixit對於iPhone 6e的可修復性評分為7分。編輯：芯智訊-浪客劍","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"1","news_tag":"productRelease","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}