全球半導體技術競速：先進製程與封裝引領產業新局

報告大廳

2025/04/06

中國報告大廳網訊，當前全球半導體市場正經歷激烈的技術競賽，AI應用需求激增推動行業加速突破工藝極限。在終端市場需求復甦緩慢的背景下，頭部廠商通過先進製程和封裝技術創新爭奪市場主導權。英特爾、三星、台積電等企業相繼公布技術進展，日本Rapidus更以2納米研發計劃宣告重返尖端賽道，折射出半導體產業向更高性能與更低功耗進發的核心趨勢。一、英特爾18A製程突破：RibbonFET與PowerVia...

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2600芯片預計2025年5月進入試生產，目標將功耗降低25%、性能提升12%，同時減少5%芯片面積。目前該產品良品率已達30%，隨着工藝成熟有望進一步提升至行業標準水平。未來三星將持續擴展SF系列節點佈局，覆蓋高性能計算及汽車電子等高增長領域。  四、台積電雙軌並進：製程與封裝協同構築護城河  在先進製程方面，台積電高雄2納米廠區建設按計劃推進，預計2025年下半年進入量產階段。相較於3納米技術，新一代工藝可在同等性能下提升1015%速度，或降低2530%功耗。封裝領域則通過AP8廠擴產將CoWoS產能翻倍至每月7.5萬片晶圓，滿足AI芯片異構集成需求。這種\"製程+封裝\"的協同創新模式，正成為其鞏固代工龍頭地位的核心戰略。  總結來看，半導體產業的技術競爭已進入納米級精度較量階段。英特爾在供電架構上的先發優勢、台積電的規模化量產能力、三星的激進工藝迭代路徑以及Rapidus的本土化突破嘗試，共同構成了當前行業的創新圖譜。隨着AI算力需求持續爆發，先進製程與封裝技術的協同進化將成為決定企業市場地位的關鍵變量，而良率提升速度與成本控制效率則將最終定義這場競賽的終極贏家。更多半導體行業研究分析，詳見中國報告大廳《半導體行業報告匯總》。這裏匯聚海量專業資料，深度剖析各行業發展態勢與趨勢，為您的決策提供堅實依據。更多詳細的行業數據盡在【數據庫】，涵蓋了宏觀數據、產量數據、進出口數據、價格數據及上市公司財務數據等各類型數據內容。","kind":"news","is_publish_news":true,"is_publish_highlight":false,"is_publish_live":false,"is_publish_wemedia":null,"editions":null,"column":"","sentiment":"0","news_tag":"","news_rank":0,"symbols":[],"gpt_button":0,"need_auth":false,"code":"91000000","status":"200"}}}