Applied Materials buys 9% stake in advanced packaging firm BESI

Reuters
04/15
Applied Materials buys 9% stake in advanced packaging firm BESI

April 15 (Reuters) - Applied Materials AMAT.O has bought a 9% stake in BE Semiconductor industries (BESI) BESI.AS, the U.S.-based computer chip equipment supplier said on Monday.

The Dutch semiconductor advanced packaging firm produces the world's most accurate hybrid bonding tool, a critical chip technology allowing two chips to be bonded directly on top of each other.

Applied Materials said it did not intend to seek board representation at BESI.

(Reporting by Nathan Vifflin, editing by Milla Nissi)

((nathan.vifflin@thomsonreuters.com; +48 58 769 67 13;))

免責聲明:投資有風險,本文並非投資建議,以上內容不應被視為任何金融產品的購買或出售要約、建議或邀請,作者或其他用戶的任何相關討論、評論或帖子也不應被視為此類內容。本文僅供一般參考,不考慮您的個人投資目標、財務狀況或需求。TTM對信息的準確性和完整性不承擔任何責任或保證,投資者應自行研究並在投資前尋求專業建議。

熱議股票

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10