建滔积层板(01888)今日在港交所盘中大涨5.06%,报收7.41港元,成交额逾2300万港元,引发了市场广泛关注。
消息面上,科技巨头掀起数据中心建设潮,为PCB行业带来了广阔发展前景。其中,亚马逊云计算部门AWS计划在佐治亚州投资至少110亿美元,扩大基础设施并支持云计算和人工智能技术。微软方面则表示,2025财年AI数据中心开支将达800亿美元。在此趋势推动下,PCB行业景气度有望持续上行。
值得一提的是,建滔积层板是覆铜板行业龙头企业。分析人士指出,伴随2024年铜价上涨和下游需求回暖,建滔积层板有望凭借成本优势和规模效应,重新实现收入与利润增长。市场预期建滔积层板将充分受益于PCB行业景气周期,成为其股价今日大涨的主要推手。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.