领先车规芯片企业黑芝麻智能2月19日股价盘中大跌5.32%,引发市场广泛关注。主因公司当日宣布配股融资计划。
据公告,黑芝麻智能拟配售5,365万股股份,占经扩大已发行股份约8.55%,每股配售价23.2港元,较2月18日收市价26.3港元折让约11.79%。该公司预计配售事项的所得款项净额(扣除佣金等费用后)约12.37亿港元。
所得款项主要将用于(i)进一步支持集团核心技术研发,包括但不限于新一代汽车自动驾驶芯片及IP核、以及人工智能等尖端技术研发;(ii)提升集团商品化能力;(iii)选择性进行战略性投资;及(iv)公司一般营运资金。公司表示,经考虑近期市况,此次配股融资是合适选择,有利于支持集团持续发展及业务增长,符合公司及股东整体利益。
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