今日,三倍做多半导体ETF盘中大涨5.01%,引发市场广泛关注。分析人士认为,这与近期半导体行业新兴封装技术的进展密切相关。
摩根士丹利最新报告指出,在摩尔定律放缓的背景下,半导体行业正在加大对先进封装技术的投入,其中利用玻璃材料进行封装日渐受到重视。与现有硅晶圆相比,玻璃基底可提供更大尺寸、更佳电性能、可调整的热膨胀系数等优势,有望带来20%-30%的成本节约。
多家大型芯片公司和供应商如英特尔、台积电、美光等已逐步布局玻璃封装技术。虽然目前仍存在一些技术挑战需要克服,但分析人士预计未来几年该市场将快速增长。据估计,到2028年玻璃扇出式面板级封装市场规模将达到2.52亿美元。
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