意法半导体与高通达成无线物联网战略合作，首批产品预计明年 Q1 供货
10 月 10 日消息，意法半导体与高通公司旗下子公司高通技术国际有限公司宣布，双方达成一项新的战略协议，合作开发基于边缘 AI 的下一代工业和消费物联网解决方案。
意法半导体将推出内置高通科技的 Wi-Fi / 蓝牙 / Thread 多协议 SoC 产品组合的独立模块，可与任何 STM32 通用微控制器产品进行系统级集成。此次合作开发的首批产品预计将于 2025 年第一季度向 OEM 厂商供货，随后将扩大供货范围。
未来，双方还计划推出更多 Wi-Fi / 蓝牙 / Thread 组合 SoC 产品，并逐步扩展到工业物联网的蜂窝连接领域。
意法半导体今年第二季度净营收总计 32.3 亿美元（备注：当前约 228.7 亿元人民币），同比下降 25.3%。OEM 和代理两个渠道的净销售收入同比分别降低 14.9% 和 43.7%。净营收环比降低 6.7%。该季度毛利润总计 13 亿美元（当前约 92.05 亿元人民币），同比下降 38.9%。毛利率为 40.1%
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