玻璃——先进封装的大机会

华尔街见闻
29 Oct 2024

在摩尔定律放缓的背景下,半导体行业在先进封装中投入更多资源,目前封装主流技术现在利用硅晶圆,但随着芯片尺寸和芯片集成数量的持续增长,玻璃材料越来越受到关注。 鉴于玻璃基本可能提供更好的成本效益,玻璃在先进封装中的应用逐渐兴起,摩根士丹利在本周的最新报告中分析了玻璃在在半导体行业的应用潜力、优势、挑战以及市场前景。 首先是优势和不足方面,大摩指出: 优势:除了更大面板尺寸带来的成本优势外,玻璃可以...

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