中银国际发表报告，指ASMPT(00522.HK) 倘将1.08亿港元汇兑损失加回，ASMPT2024年第三季度业绩略高于市场预期，这主要得益于先进封装(AP)业务的强劲增长。
报告称，尽管主流业务以及非AI相关的半导体市场复苏慢于预期，该行仍看好生成式AI对热焊压机TCB和硅光子技术的结构性需求，以及ASMPT在晶圆代工厂、封测厂、逻辑IDM和储存IDM客户群中的订单获取能力。
中银国际下调ASMPT2024至2026年各年年盈测分别34%、5%及1%，主要反映近期主流业务需求复复苏缓慢，但中期来看该行仍然看好ASMPT在TCB领域的增长潜力。维持“买入”评级，目标价从112港元下调至107港元。(da/w)(港股报价延迟最少十五分钟。沽空资料截至 2024-10-31 16:25。)
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