AMD、高通亮相进博会,半导体芯片龙头带来了哪些尖端产品?

时代周报
08 Nov 2024

第七届中国国际进口博览会(下称“进博会”)正在上海举行。AMD、阿斯麦(ASML)、高通等国际顶尖半导体公司集体亮相,对外展示了一系列最新产品。其中,AMD带来了第五代AMD EPYC处理器,高通的参展代表是骁龙8至尊版移动平台,三星则是NQ8 AI Gen3芯片。11月6日,时代周报记者走访技术装备展区,对多家半导体产业链上下游的龙头企业的展区进行了采访,发现各大厂商在积极拥抱AI的同时,在国内...

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