智通财经APP获悉，ASMPT(00522)现跌超5%，截至发稿，跌5.05%，报79.05港元，成交额1.34亿港元。
高盛发表报告指出，ASMPT近期获得针对高频宽记忆体(HBM)应用的热压焊接(TCB)工具重大订单，标志着公司向记忆体市场渗透的重要里程碑，预计公司将持续获得/交付先进封装工具的订单，涉及热压焊接与混合键合(HB)等工具。该行认为ASMPT的传统封装和表面贴装技术(SMT)近期仍面临挑战，并预料有关的缓慢增长势头短期内将可能持续。
花旗发布研究报告称，ASMPT第三季的收入及毛利率胜于预期，但盈利因汇率亏损而逊于预期。先进封装持续带动增长，虽然需求仍然疲弱，但管理层认为主流的半导体解决方案(SEMI)开始复苏，而表面贴装技术(SMT)亦开始触底反弹。鉴于正常的季节因素，第四季指引显示收入将出现季节性下滑。该行表示，对ASMPT明年增长拐点有信心，TCB将迎来转折点，销售额将同比增加一倍。新获得的TCB和潜在的私有化出价或成为其正面股价催化剂。
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