【SEMI：Q3硅晶圆出货量创5个季度来新高 明年延续上升趋势】金十数据11月13日讯，国际半导体产业协会（SEMI）最新报告显示，第三季度全球硅晶圆出货量持续增加，达32.14亿平方英寸，环比增长5.9%、同比增长6.8%，并创5个季度来新高，并预期2025年有望延续上升趋势。SEMI指出，整体供应链库存水平下降，不过整体仍处于较高水平。观察用于人工智能（AI）的先进硅晶圆需求持续强劲，汽车和工业用途的硅晶圆需求依然疲软，手机和其他消费产品用的需求在某些领域有所改善。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.