【晶合集成：今年3月至今产能持续处于满载状态】金十数据11月15日讯，在今日举行的第三季度业绩会上，晶合集成董事、董事会秘书朱才伟表示，公司自今年3月起订单充足，产能持续处于满载状态，预计2024年第四季度产能利用率维持高位水平。2024年公司此前计划扩产3万片/月—5万片/月，扩充的产能已于今年8月份起陆续释放。据他介绍，公司目前已实现150nm至55nm制程平台的规模量产，40nm高压OLED芯片工艺平台已实现小批量生产。
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.