摩根士丹利发表研报，重新恢复对ASMPT(00522.HK) 的覆盖，给予“与大市同步”评级，目标价为82元。
该行指出，半导体和电子产品制造业主流市场复苏步伐仍然缓慢，但在先进封装领域方面，ASMPT已于高带宽内存(HBM)市场取得突破。管理层预测第四季销售收入将按年跌3.5%至4.2亿美元，新增订单总额预期将按季持平，当中半导体业务受到先进封装的推动，预料较第三季增长，不过有部分会被季节性因素导致的主流产品销售下跌所抵销，而表面贴装技术(SMT)则预期依然受到市场持续疲软和库存消化的打击。
大摩看好ASMPT在HBM市场的热压焊接(TCB)应用，预期TCB相关收入于2023至2026年的年均复合增长率可达到65%。(gc/a)(港股报价延迟最少十五分钟。沽空资料截至 2024-11-19 16:25。)
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