美国半导体设备和服务供应商应用材料公司(Applied Materials)在新加坡设立全新的异构集成合作平台,促进业界之间的合作,推动新芯片架构、材料和工艺方面的创新。 副总理兼贸工部长颜金勇星期二(11月19日)在新平台的推介仪式上讲话时说,这个新的平台不仅给应用材料公司带来好处,同时也会惠及本地半导体生态系统。 他指出,通过这个平台,新加坡的芯片制造商、系统公司和半导体公司将能够接触下一代的...
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