三星电子正在扩大其在国内外生产基地的投资,以加强其先进的半导体封装业务。随着下一代高带宽内存(HBM)产品(如HBM4)的内部封装流程的重要性增加,三星正专注于提升其封装能力,以确保未来的技术竞争力,并缩小与SK海力士的差距。据行业消息,三星电子在第三季度签署了一份设备采购合同,目的是扩大其在中国苏州工厂(SESS)的生产设施。该合同价值约200亿韩元(1.04亿元人民币)。苏州工厂目前是三星电子...
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