当地时间12月2日,拜登政府出台新的对华半导体出口管制措施。 上上周,外媒就放风称拜登政府将推出新的管制措施,并且还提到,新措施将涉及200家中国芯片企业。到上周,外媒又称美国政府推翻了原先的方案,将制裁名单砍掉了一半。 最终的方案,涉及136家中国实体和4家中国实体海外子公司,管制的范围也相对聚焦,主要针对用于先进人工智能的芯片,并且管制对象主要是这类芯片的制造设备企业。 在同一时间,另一个趋势...
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