半导体巨头力挺中国!恩智浦芯片将实现纯“中国制造”

快科技官方
06 Dec 2024

晶圆代工大厂世界先进与芯片大厂恩智浦半导体(NXP)在新加坡合资的12英寸晶圆厂正式于4日正式动工,将于2027年开始量产,预计2029年月产能将达55,000片12英寸晶圆。值得一提的,恩智浦执行副总裁Andy Micallef在仪式后接受采访时透露,恩智浦还在努力寻找一种方式来服务那些需要中国产能的客户,并表示“我们将建立一条中国供应链”。 总投资78亿美元,恩智浦与世界先进新加坡合资...

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