快科技12月5日消息,本周,美国工业和安全局 (BIS) 正式修订了《出口管理条例》(EAR),将 140个中国半导体行业相关实体添加到“实体清单”。具体来说,美国BIS正在实施多项监管措施,包括但不限于:对生产先进节点集成电路(IC)所需的半导体制造设备实施新管制;对开发或生产先进节点集成电路的软件工具实施新管制;对高带宽存储器 (HBM) 实施新管制。对于这样的情况,显然不足以对中国半导体行业...
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