智通财经APP获悉,周三,联电(UMC.US)涨逾3%,报6.74美元。据媒体报道,联电夺得高通高性能计算(HPC)产品的先进封装大单,预计将应用在AI PC、车用以及AI服务器市场,甚至包括HBM的整合。联电未对单一客户做出回应,但强调先进封装是公司重点发展的方向,并会与智原、硅统等子公司及存储供应伙伴华邦共同打造先进封装生态系统。
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