金吾财讯 | 联电(UMC)盘前涨超1%，截至发稿，报6.62美元。消息面上，据媒体报道，联电夺得高通(QCOM)高性能计算(HPC)产品的先进封装大单，预计将应用在AI PC、车用以及AI服务器市场，甚至包括HBM的整合。联电未对单一客户做出回应，但强调先进封装是公司重点发展的方向，并会与智原、硅统等子公司及存储供应伙伴华邦共同打造先进封装生态系统。知情人士透露，高通计划以定制化的Oryon架构核心委托台积电量产，并委托联电进行先进封装，预计将采用联电的WoW Hybrid bonding制程。
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