【颀中科技:电源管理芯片封装技术逐渐向先进封装迈进】金十数据12月19日讯,颀中科技近日在接待机构调研时表示,目前工业控制、汽车电子、网络通信等领域的电源管理芯片主要以传统封装为主,包括DIP、BGA、QFP/PFP、SO等封装形式。但随着下游终端需求的不断升级,尤其是以消费类电子为代表的终端对电源管理的稳定性、功耗要求和芯片尺寸要求更高,电源管理芯片封装技术逐渐从传统封装向先进封装迈进,具体包括FC、WLCSPSiP和3D封装等形式。
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