三星封装大将,离职!

半导体行业观察
02 Jan

据报道,三星电子为加强半导体封装能力而聘请的副总裁林俊成已离职。林副总裁是一位封装专家,曾于 1999 年至 2017 年在台积电工作。在美光和 Skytech 工作后,他被三星电子聘用,领导下一代高带宽存储器(HBM)HBM 4 封装技术的开发。此前,半导体行业曾有传言称,林副总去年年底有关于企业迁往中国大陆和台湾的未来计划。据半导体行业1日消息,半导体研究院系统封装实验室副院长林因与三星电子...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10