金吾财讯 | 据媒体消息，美光科技(MU)将斥资70亿美元扩大在新加坡的产能，计划兴建高频宽存储器(HBM)先进封装厂，预计明年竣工，并在2027年开始为公司的整体产能做出贡献，预计可为当地创造1,400个职位。新加坡副总理兼贸工部长颜金勇表示，半导体业是新加坡先进制造业的关键领域，占国内生产总值的8%，政府将会加倍投资以推动专精半导体如NAND快闪存储器的发展，或开发高频宽存储器等的新领域。
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