1月8日，美光科技在新加坡的新工厂破土动工，未来将投资70亿美元，于2026年开始运营，并从2027年开始扩大美光的先进封装总产能。该类芯片广泛应用于人工智能数据中心，受益于人工智能对先进存储芯片的需求提振。
中信证券表示，HBM是能够满足AI算力芯片高速传输需求的新型存储，于2014年推出，配套算力需求持续爆发式增长，我们测算至2025年全球HBM容量需求将接近17亿GB，占DRAM出货总容量超10%，占DRAM市场产值超30%。美国对华先进存储限制加码，有望促使高端存储产业链加快国产化进程。
甬兴证券研报中写到，持续看好受益先进算力芯片快速发展的HBM产业链、以存储为代表的半导体周期复苏主线。HBM：受益于算力芯片提振HBM需求，相关产业链有望迎来加速成长，建议关注赛腾股份、壹石通、联瑞新材、华海诚科等；存储芯片：受益于供应端推动涨价、库存逐渐回归正常、AI带动HBM、SRAM、DDR5需求上升，产业链有望探底回升。推荐东芯股份，建议关注兆易创新、恒烁股份、佰维存储、江波龙、德明利等。
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