智通财经APP获悉，建滔积层板(01888)早盘涨超6%，截至发稿，涨6.44%，报7.11港元，成交额2381.08万港元。
消息面上，亚马逊云计算部门亚马逊网络服务（AWS）计划在佐治亚州投资至少110亿美元，以扩大其基础设施，并支持各种云计算和人工智能技术。而微软此前表示2025财年AI数据中心开支800亿美元，北美云厂商2025财年资本开支高增长的趋势确定。
招商电子团队指出，在AI技术和应用的推动下，服务器将是PCB增长最快的应用领域，预计23-28年CAGR达11.6%至142亿美元。据悉，PCB制造环节包括将覆铜板(CCL)进行钻孔、镀铜、印刷、焊接等加工环节，最终形成电路板。开源证券此前指出，建滔积层板为覆铜板行业龙头，伴随2024年铜价有所上涨，下游需求逐步回暖，覆铜板具备弹性调价空间，叠加供应链垂直整合与规模效应下的成本优势，有望驱动公司2024年收入与利润重回增长轨道。
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