智通财经APP获悉，建滔积层板(01888)再涨超4%，截至发稿，涨3.51%，报7.37港元，成交额1618.16万港元。
消息面上，科技巨头掀起数据中心建设潮。其中，亚马逊云计算部门亚马逊网络服务（AWS）计划在佐治亚州投资至少110亿美元，以扩大其基础设施，并支持各种云计算和人工智能技术。而微软此前表示2025财年AI数据中心开支800亿美元。在此趋势推动下，PCB行业景气度有望持续上行。
据悉，PCB制造环节包括将覆铜板(CCL)进行钻孔、镀铜、印刷、焊接等加工环节，最终形成电路板。开源证券此前指出，建滔积层板为覆铜板行业龙头，伴随2024年铜价有所上涨，下游需求逐步回暖，覆铜板具备弹性调价空间，叠加供应链垂直整合与规模效应下的成本优势，有望驱动公司2024年收入与利润重回增长轨道。
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