【德福科技:超高端载体铜箔通过验证将替代进口】金融界1月11日消息,德福科技披露投资者关系活动记录表显示,公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核,2025年起将陆续替代进口产品。同时,公司高频通信及高速服务器市场已实现大量国产化替代,高端应用通过深南电路、胜宏科技等PCB厂商验证,并在英伟达项目中实现应用,预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。

金融界
11 Jan
金融界1月11日消息,德福科技披露投资者关系活动记录表显示,公司自主研发的超高端载体铜箔已通过某存储芯片龙头公司的验证和工厂制造审核,2025年起将陆续替代进口产品。同时,公司高频通信及高速服务器市场已实现大量国产化替代,高端应用通过深南电路胜宏科技等PCB厂商验证,并在英伟达项目中实现应用,预计2025年高频高速PCB领域及AI终端应用相关产品出货量将达数千吨级别。

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