据报道,日本初创晶圆代工厂 Rapidus Inc. 计划于 6 月向美国无晶圆厂芯片公司博通供应 2nm 原型 IC 。此次供货是 Rapidus 为争取其代工服务客户而采取的举措之一,该服务基于与 IBM 的技术合作。Rapidus 成立于 2022 年,是日本为重回尖端硅片制造竞争而做出的一项国家努力。尖端芯片制造市场由代工厂台积电主导。然而,英伟达和苹果等客户对尖端制造的需求如此之大,...
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