博通,要押注3.5D封装

半导体产业纵横
17 Jan

本文由半导体产业纵横(ID:ICVIEWS)编译自electronicdesign该技术集成了 2.5D 封装技术和 3D 硅堆叠,有望迎来下一代人工智能“超级芯片”。处于 AI 芯片市场前沿的半导体公司和初创公司在规模方面的竞争与其他领域一样激烈。它们都在竞相推出巨型图形处理单元 (GPU) 和其他 AI 芯片,以处理 OpenAI ChatGPT 和其他最先进算法的核心——大型语言模型 (...

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