快科技1月21日消息,研究机构TechInsights今天表示,其揭示了三星HBM3内存的首个商用实例,该内存集成在AMD的MI300X AI加速器中。TechInsights称,三星于2023年8月宣布HBM3内存面世,其在商用产品中的部署对内存制造商和AI芯片制造商来说都是一个重要的里程碑。据了解,MI300X拥有最多8个XCD核心,304组CU单元,8组HBM3核心,显存容量提升到了...
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