Rapidus 与 IBM 合作在美制造 2nm GAA 原型晶圆亮相,在日试产 4 月启动

IT之家
21 Jan

IT之家 1 月 21 日消息,据日媒 EE Times Japan 报道,日本先进半导体制造商 Rapidus 在 2024 年 12 月 11~13 日举行的 SEMICON Japen 2024 上,展示了其与 IBM 合作在美国纽约州奥尔巴尼纳米技术综合体制造的 2nm GAA(IT之家注:全环绕栅极)晶体管原型晶圆。 ▲ 图源 EE Times Japan 该晶圆的出现对外表明 ...

Source Link

Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.

Most Discussed

  1. 1
     
     
     
     
  2. 2
     
     
     
     
  3. 3
     
     
     
     
  4. 4
     
     
     
     
  5. 5
     
     
     
     
  6. 6
     
     
     
     
  7. 7
     
     
     
     
  8. 8
     
     
     
     
  9. 9
     
     
     
     
  10. 10