Jilin Sino-Microelectronics (SHA:600360) plans to mortgage some of its assets for a loan worth 180 million yuan from China Construction Bank (HKG:0939, SHA:601939) for its business development needs, according to a Shanghai Stock Exchange disclosure on Jan. 22.
The assets comprise part of the company's real estate in High-tech Zone, Jilin City, China, which has a total land area of 112,387.81 square meters and a building area of 36,512.39 square meters, and part of its production machinery and equipment.
The mortgage period is 13 months, the filing said.
Disclaimer: Investing carries risk. This is not financial advice. The above content should not be regarded as an offer, recommendation, or solicitation on acquiring or disposing of any financial products, any associated discussions, comments, or posts by author or other users should not be considered as such either. It is solely for general information purpose only, which does not consider your own investment objectives, financial situations or needs. TTM assumes no responsibility or warranty for the accuracy and completeness of the information, investors should do their own research and may seek professional advice before investing.