金融界2025年1月31日消息，国家知识产权局信息显示，安华高科技股份有限公司申请一项名为“具有一或多个通路的加强构件”的专利，公开号 CN 119381353 A ，申请日期为2024年6月。
专利摘要显示，本公开涉及具有一或多个通路的加强构件。提供用于实施半导体封装或芯片封装的新颖工具及技术，且更特定来说，提供用于实施包含具有通路的加强构件的半导体封装或芯片封装的方法、系统及设备。在各种实施例中，一种设备包含衬底及电耦合到所述衬底的连接器。加强构件安置在所述衬底与所述连接器之间且经配置以限制所述衬底或所述连接器中的至少一者。通路延伸穿过所述加强构件的主体且将所述连接器电耦合到所述衬底。
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