Release Date: January 29, 2025
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
Q: Can you speak about the gross margin guidance and the factors affecting it as you move through March and the rest of the year? A: Douglas Bettinger, CFO, explained that gross margins are expected to remain in a tight range, with potential headwinds from customer concentration. However, the Asia operation strategy is expected to offset some of these headwinds. He advised not to expect significant changes from the current levels.
Q: Can you provide any color on NAND spending for the year, and is it possible that it could double? A: Douglas Bettinger, CFO, noted that NAND spending will increase this year, though he is unsure if it will double. He mentioned that some NAND spending will occur in China with customers they cannot sell to, which might differ from other peers' perspectives. Leading-edge foundry is expected to be strong, and DRAM spending will remain robust.
Q: What is the impact of recent China export controls on Lam's business in 2025? A: Douglas Bettinger, CFO, stated that the new regulations restrict a handful of customers, impacting Lam's forecast by approximately $700 million. This revenue would have been slightly weighted towards the second half of 2025.
Q: How should we think about the split between systems and CSBG in March and how it evolves through the rest of the year? A: Douglas Bettinger, CFO, mentioned that while he won't provide specific details, there are headwinds in CSBG related to the Reliant grouping due to limited spending in mature nodes outside China. However, upgrades are expected to be strong, particularly in NAND, benefiting the upgrade product line within CSBG.
Q: Can you provide insights into the advanced packaging and high bandwidth memory growth profile for this year and beyond? A: Douglas Bettinger, CFO, indicated that advanced packaging revenue exceeded $1 billion in 2024 and is expected to grow in 2025. The growth is driven by transitions in HBM and advanced packaging technologies, such as moving from 2.5D to 3D structures.
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
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