Release Date: February 05, 2025
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
Q: Fusen, you mentioned that the March quarter general semiconductor should grow. Is it fair to assume that sequentially, into June and September, your bonder revenue should grow sequentially? A: Yes, we anticipate growth despite some delays in customer investment decisions due to the Chinese New Year and global political dynamics. We expect the transition to more normalized levels of ball bonding later this year, with the second half of fiscal '25 potentially being 20% to 30% higher than the first half.
Q: Can you provide more details on the customers using your thermo-compression bonding tool and which ones will be the biggest growth drivers? A: We have multiple customers, including foundries, IDMs, and OSATs. Between those using it in high-volume production and those qualifying it, we have close to 8 to 10 customers engaged with our TCB bonders.
Q: Regarding the dual-head tool for the HBM market, what are your throughput advantages versus the competition? A: Our dual-head tool provides better electrical performance and productivity compared to competitors. We aim for high reliability and slightly better throughput, which are key metrics for success in the HBM market.
Q: What is the expected market share for your vertical wire solution in the DRAM market, traditionally dominated by a Japanese competitor? A: We expect to have a strong position in the VFO market across all three leading DRAM customers. We are confident in our ability to capture significant market share in this area.
Q: How do you see the core markets' recovery affecting your margin structure? A: We aim to maintain gross margins around 50%. As we introduce new products with higher margins and focus on cost reduction, we expect margins to improve, especially with higher factory utilization as volumes increase.
For the complete transcript of the earnings call, please refer to the full earnings call transcript.
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