台积电 171 亿美元豪赌,剑指先进制程和封装

IT之家
12 Feb

根据台积电今天(2 月 12 日)发布的新闻稿,台积电计划投资 171.41 亿美元(IT之家备注:当前约 1252.63 亿元人民币),用于安装和升级先进技术和先进封装产能,提升成熟及特殊技术产能,扩建晶圆厂以及安装晶圆厂配套设施系统等。

IT之家援引官方新闻稿,台积电为了满足市场需求及其自身技术开发路线图,董事会批准了 171.414 亿美元的资本拨款,用于以下 3 个方面:

安装和升级高级技术产能

安装和升级高级封装、成熟和专业技术产能

扩建晶圆厂以及安装晶圆厂配套设施系统

在官方新闻稿发布前,有消息称台积电可能会公布第三座亚利桑那晶圆厂、潜在的第四座晶圆厂或其首个先进封装厂的计划,但目前尚未确认任何更新。

台积电在 1 月中旬的财报电话会议上曾表示,其 2025 年的资本支出将在 380 亿至 420 亿美元之间,这意味着同比增长高达 40%。

责任编辑:钟离

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