金吾财讯 | 中信证券表示，随着AI技术进步，消费电子及服务器需求的增长，PCB铜箔的需求有望持续提升，高端PCB铜箔更加紧俏，该行预计2023-2030年全球高端PCB铜箔的需求CAGR有望达到10%，2030年市场规模达到360亿元。国内铜箔厂商在高端PCB铜箔领域实现重大技术突破，英伟达等客户逐步认可国内高端PCB铜箔，国产厂商有望打破外资企业在高端PCB铜箔领域的垄断。该行预计2030年国内厂商有望获得15%的高端PCB铜箔市场份额，对应54亿元的市场规模，对应2023-2030年CAGR为42%。
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