【中信证券:打破技术垄断,高端PCB铜箔国产化可期】金十数据2月12日讯,中信证券指出,随着AI技术进步,消费电子及服务器需求的增长,PCB铜箔的需求有望持续提升。铜箔行业历史上两次产能转移带来技术转移,随着PCB铜箔产能向中国大陆迁移,国内铜箔厂商的技术水平正不断提高,德福科技PCB铜箔的性能已接近海外头部企业,并获得英伟达等客户认可。我们预计2030年全球高端PCB铜箔市场规模为360亿元,随着国内铜箔企业持续建设高端PCB铜箔产能,推进下游客户认证,我们预计2030年国内企业有望占据高端PCB铜箔市场15%的份额,对应54亿元的市场规模,2023-2030年CAGR为42%。
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